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Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal c
  • ISSN号：0957-4522
  • 期刊名称：Journal of Materials Science-Materials in Electron
  • 时间：2016.2
  • 页码：1184-1190
  • 相关项目：Sn基无铅焊料电迁移的各向异性研究
作者： Zhu, Qingsheng|Shang, Jianku|Zhang, Li|Guo, Hongyan|
同期刊论文项目
Sn基无铅焊料电迁移的各向异性研究
期刊论文 12 会议论文 2
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