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Magnetic-field induced anisotropy in electromigration behavior of Sn-Ag-Cu solder interconnects
  • ISSN号：0884-2914
  • 期刊名称：Journal of Materials Research
  • 时间：2015.4.28
  • 页码：1065-1071
  • 相关项目：Sn基无铅焊料电迁移的各向异性研究
作者： Ma, Hui-Cai|Liu, Kai-Lang|Zhu, Qing-sheng|Shang, Jian Ku|
同期刊论文项目
Sn基无铅焊料电迁移的各向异性研究
期刊论文 12 会议论文 2
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