欢迎您!
东篱公司
退出
申报数据库
申报指南
立项数据库
成果数据库
期刊论文
会议论文
著 作
专 利
项目获奖数据库
位置:
成果数据库
>
期刊
> 期刊详情页
Reliability and failure mechanism of copper pillar joints under current stressing
ISSN号:0957-4522
期刊名称:Journal of Materials Science: Materials in Electro
时间:2015.10
页码:7690-7697
相关项目:Sn基无铅焊料电迁移的各向异性研究
作者:
Zhu, Qing-Sheng|Shang, Jian Ku|Zhang, Li|Guo, Hong-Yan|
同期刊论文项目
Sn基无铅焊料电迁移的各向异性研究
期刊论文 12
会议论文 2
同项目期刊论文
Dependence of electromigration damage on Sn grain orientation in Sn-Ag-Cu solder joints
Electroless Deposition of Highly Solderable Fe-Ni Films
Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint
Inhibition of Electromigration in Eutectic SnBi Solder Interconnect by Plastic Prestraining
Copper Bottom-up Filling for Through Silicon Via (TSV) Using Single JGB Additive
Phase identification on the intermetallic compound formed between eutectic SnIn solder and single cr
Phase transformation between Cu(In,Sn)(2) and Cu-2(In,Sn) compounds formed on single crystalline Cu
Magnetic-field induced anisotropy in electromigration behavior of Sn-Ag-Cu solder interconnects
Thermal Performance of Low-Melting-Temperature Alloy Thermal Interface Materials
Microstructure evolution in metals induced by high density electric current pulses
Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal c