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3D CMOL: 3D Integration of CMOS/Nanomaterial Hybrid Digital Circuits
  • 期刊名称：IEE Micro & Nano Lett.
  • 时间：0
  • 页码：40-45
  • 语言：中文
  • 相关项目：基于Top-down的分子存储器的加工工艺研究
作者： 刘明|
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基于Top-down的分子存储器的加工工艺研究
期刊论文 31 会议论文 13 专利 9
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