中文摘要：

研究了超高压处理对枯草芽孢杆菌（Bacillus subtilis AS 1．140）超微结构的影响，探讨其营养体以及芽孢的灭活机制。在经过500MPa、60℃下保温保压20min超高压处理后，采用透射电子显微镜进行观察，比较处理前后超微结构的变化。观察结果表明：超高压处理后，枯草芽孢杆菌的营养体细胞壁皱缩、出现缺口，胞浆泄漏、结构层次感消失、出现大片透电子区；其芽孢外壳被破坏、出现缺口，芽孢内含物结构紊乱、泄漏、出现部分透电子区；甚至内含物质完全泄漏，出现细胞壁或孢子外壳残留。

英文摘要：

The effect of ultra-high pressure processing on the microstructure of Bacillus subtilis AS 1.140 was investigated,and the inactivation mechanism of its vegetative form and spore was studied. The change of B. subtilis microstructures were analyzed and compared in terms of the oberation with a Transmission Electron Microscope （TEM） after UHPP （500 MPa, 60℃, 20 min）. Results showed that the vegetative cell wall of B. subtilis was shrinked, breached and leaked out cytoplasm, the layer structure of cytoplasm disappeared, and a large electron transmission area appeared in the cell after compression. The outer coat of its spores was also breached, the layer structure of spores＇ inclusion disordered, the inclusion leaked out from the cell, and a partial electron transmission area appeared after compression.