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Effect of pH on Material Removal Rate of Cu in Abrasive-Free Polishing
  • ISSN号：0013-4651
  • 期刊名称：JOURNAL OF THE ELECTROCHEMICAL SOCIETY
  • 时间：0
  • 页码：H176-H180
  • 相关项目：极大规模集成电路铜互连平坦化新原理及其应用研究
作者： Zhang Wei|Lu Xinchun|Liu Yuhong|Pan Guoshun|Luo Jianbin|
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极大规模集成电路铜互连平坦化新原理及其应用研究
期刊论文 24 专利 72
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