欢迎您!
东篱公司
退出
申报数据库
申报指南
立项数据库
成果数据库
期刊论文
会议论文
著 作
专 利
项目获奖数据库
位置:
成果数据库
>
期刊
> 期刊详情页
Modeling the Chemical-Mechanical Synergy during Copper CMP
ISSN号:0013-4651
期刊名称:Journal of the Electrochemical Society
时间:0
页码:197-202
相关项目:极大规模集成电路铜互连平坦化新原理及其应用研究
作者:
Li Jing|Lu Xinchun|He Yongyong|Luo Jianbin|
同期刊论文项目
极大规模集成电路铜互连平坦化新原理及其应用研究
期刊论文 24
专利 72
同项目期刊论文
Effect of pH on Material Removal Rate of Cu in Abrasive-Free Polishing
Influence of pH, immersion time, and benzotriazole concentration on copper corrosion in citric acid
A lubrication model between the soft porous brush and rigid flat substrate for post-CMP cleaning
Modeling of particle removal processes in brush scrubber cleaning
Effects of the ultrasonic flexural vibration on the interaction between the abrasive particles; pad
Mechanisms for nano particle removal in brush scrubber cleaning
In Situ Measurement of Fluid Pressure at the Wafer-Pad Interface during Chemical Mechanical Polishin
Effect of kinematic parameters and their coupling relationships on global uniformity of chemical-mec
Atomic layer deposition of zinc oxide films: Effects of nanocrystalline characteristics on tribologi
Experimental Investigation of Lubricant Flow Properties Under Micro Oil Supply Condition
化学机械抛光传输机器人模型及LQ控制
化学机械抛光传输机器人晶圆抓取自适应控制方法