位置：成果数据库 > 期刊 > 期刊详情页
Effect of deposit thickness during electroplating on Kirkendall voiding at Sn/Cu joints
  • ISSN号：0167-577X
  • 期刊名称：Materials Letters
  • 时间：2014.4.25
  • 页码：9-11-
  • 相关项目：微焊点界面柯肯达尔空洞机理研究
作者： Chun Yu|Yang Yang|Jieshi Chen|Jijin Xu|Junmei Chen|Hao Lu|
同期刊论文项目
微焊点界面柯肯达尔空洞机理研究
期刊论文 18 会议论文 4
同项目期刊论文
Interdiffusion at the interface between Sn-based solders and Cu substrate
Finite element simulation of butt welded 2.25Cr-1.6W steel pipe incorporating bainite phase transfor
Suppression effect of Cu and Ag on Cu3Sn layer in solder joints
Effect of electric field and Sn grain orientation on Cu consumption in Sn/Cu solder joint
Relation between Kirkendall voids and intermetallic compound layers in the SnAg/Cu solder joints
Study of Cu6Sn5 and Cu3Sn growth behaviors by considering Trace Zn
Phase stability, magnetism, elastic properties and hardness of binary iron nitrides from first princ
锌对SnxZn /Cu 界面微空洞的影响
First-principles calculations of Zn substitutions in Cu6Sn5
Effects of additive elements on structural and electronic properties of Sn-based intermetallics by f
Mechanical properties and microstructure analysis of refilling friction stir welding on 2219 aluminu
铁氮化合物稳定性和弹性性能的第一性原理研究
微量Ni对Sn/Cu界面组织形貌及柯氏孔洞形成的影响
锌对SnxZn／Cu界面微空洞的影响
电镀电流密度对锡/电镀铜接头界面空洞的影响
铝合金双主轴回抽式搅拌摩擦焊温度场分析