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Interdiffusion at the interface between Sn-based solders and Cu substrate
  • ISSN号：0026-2714
  • 期刊名称：Microelectronics Reliability
  • 时间：2013.2
  • 页码：327-333
  • 相关项目：微焊点界面柯肯达尔空洞机理研究
作者： Yang Yang|Li Yongzhi|Lu Hao|Yu Chun|Chen Junmei|
同期刊论文项目
微焊点界面柯肯达尔空洞机理研究
期刊论文 18 会议论文 4
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