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Study of Cu6Sn5 and Cu3Sn growth behaviors by considering Trace Zn
  • ISSN号：0167-577X
  • 期刊名称：Materials Letters
  • 时间：2014.1.31
  • 页码：166-169
  • 相关项目：微焊点界面柯肯达尔空洞机理研究
作者： Chun Yu|Dongye Wang|Jieshi Chen|Jijin Xu|Junmei Chen|Hao Lu|
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微焊点界面柯肯达尔空洞机理研究
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