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Effect of electric field and Sn grain orientation on Cu consumption in Sn/Cu solder joint
  • ISSN号：0927-0256
  • 期刊名称：Computational Materials Science
  • 时间：2014.7.10
  • 页码：166-171
  • 相关项目：微焊点界面柯肯达尔空洞机理研究
作者： Jie-shi Chen|Meng-jia Xu|Yu-jing Jin|Kai-yun Wang|Chun Yu|Hao Lu|
同期刊论文项目
微焊点界面柯肯达尔空洞机理研究
期刊论文 18 会议论文 4
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