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Suppression effect of Cu and Ag on Cu3Sn layer in solder joints
  • ISSN号：0957-4522
  • 期刊名称：Journal of Materials Science: Materials in Electro
  • 时间：2013
  • 页码：4630-4635
  • 相关项目：微焊点界面柯肯达尔空洞机理研究
作者： Chun Yu|Jieshi Chen|Kai-yun Wang|Jingqing Chen|Hao Lu|
同期刊论文项目
微焊点界面柯肯达尔空洞机理研究
期刊论文 18 会议论文 4
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