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Defect detection of flip-chip solder joints using modal analysis
  • ISSN号：0026-2714
  • 期刊名称：Microelectronics Reliability
  • 时间：0
  • 页码：3002-3010
  • 相关项目：热/声激励的高密度超细间距倒装焊缺陷诊断方法研究
作者： Tielin Shi|Ke Wang|Zirong Tang|Guanglan Liao|
同期刊论文项目
热/声激励的高密度超细间距倒装焊缺陷诊断方法研究
期刊论文 23 会议论文 2 专利 4
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