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Thermal conduction analysis and characterization of solder bumps in flip chip package (杂志影响因子: 1.823
  • 期刊名称：Applied Thermal Engineering
  • 时间：0
  • 页码：181-187
  • 相关项目：热/声激励的高密度超细间距倒装焊缺陷诊断方法研究
作者： Lu, Xiangning|Shi, Tielin|Xia, Qi|Liao, Guanglan|
同期刊论文项目
热/声激励的高密度超细间距倒装焊缺陷诊断方法研究
期刊论文 23 会议论文 2 专利 4
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