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Using BP network for ultrasonic inspection of flip chip solder joints
  • ISSN号：0888-3270
  • 期刊名称：Mechanical Systems and Signal Processing
  • 时间：0
  • 页码：183-190
  • 相关项目：热/声激励的高密度超细间距倒装焊缺陷诊断方法研究
作者： Zheyu Zha|Xiangling Lu|Tielin Shi|Guanglan Liao|
同期刊论文项目
热/声激励的高密度超细间距倒装焊缺陷诊断方法研究
期刊论文 23 会议论文 2 专利 4
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