采用光学显微镜对纯铜连续挤压过程中组织的演变进行了分析。结果表明,纯铜在孔型轧制区和摩擦剪切区晶粒沿变形方向被拉长,镦粗区晶粒呈胞状结构,粘着区出现了剪切带,形成变形亚结构,直角弯曲区晶粒成纤维状,开始发生动态再结晶,扩展成形区晶粒发生完全动态再结晶,形成细小的再结晶晶粒。
The microstructure of copper during the process of continuous extrusion was studied with optical microscopes.The results indicated that grain in pass rolled zone and friction shear zone were stretched along the distortion orientation,the grain in upsetting zone turned into cell,shear bands and substructures were produced in sticking shear zone,the grain became fibrous and experienced a dynamic recrystallization during right-angle bending,the grain experienced a complete dynamic recrystallization and formed into fine recrystallized grain in expansion forming zone.