中文摘要：

采用电弧离子镀的方法，通过改变脉冲偏压幅值在M2高速钢表面制备了TiN／TiAlN多层薄膜，研究了脉冲电压幅值TiN／TiAlN多层薄膜微观结构和性能的变化。随着脉冲偏压幅值的增加，薄膜表面的大颗粒数目明显减少。EDX结果表明，脉冲偏压幅值的增加还引起Al／Ti原子比的降低。TiN／TiAlN多层薄膜主要以（111）晶面为择优取向生长，随着脉冲偏压幅值的增加，峰值强度逐渐增强，晶粒尺寸在8nm-14nm。制备的TiN／TiAlN多层薄膜的硬度都超过36GPa，是M2高速钢基体硬度的3．9倍以上，膜基结合力均达到60N以上。摩擦磨损测试结果表明，TiN／TiAlN多层薄膜具有良好的抗磨损性能。

英文摘要：

TiN/TiAIN multilayer coatings were prepared by arc ion plating with different pulsed bias voltages. With the increase of pulsed bias voltage, the amounts of the macroparticles were largely reduced. The increase of the pulsed bias voltage caused the decrease of AI/Ti atom ratio. The multilayer coatings exhibited growth in preferred orientation of （111） plane with the grain size ranging from 8nm to 14nm. The hardness of TiN/TiAIN multilayer coatings was over 36GPa, which was 3.9 times that of M2 high speed substrate. All the adhesion strength of TiN/TiAIN multilayer coatings was more than 60 N. All the TiN/TiAIN multilayer coatings showed better wear resistance.