中文摘要：

介绍了倒装焊接技术在MEMS压阻式压力传感器封装领域的优势和目前研制的压力敏感芯片的倒装焊的关键技术。根据封装结构设计和基板材料的不同,详细论述了国内外MEMS压阻式压力传感器倒装焊技术的研究成果。最后总结了MEMS压力传感器倒装焊技术的发展前景和所面临的挑战。

英文摘要：

The paper introduces not only advantages over flip- chip bonding technology of MEMS piezoresistive pressure sensor packaging, but also research on key technology in the realization of flip- chip bonding of pressure sensitive chip. According to the different between the design of packaging structure and substrate materials, the research achievements of flip- chip packaging at home and abroad described in detail. Finally, the paper summarizes the development prospects and present challenges of sensor flip- chip package.