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Finite element analysis of thermal stress for different Cu interconnects structure
  • ISSN号：0026-2714
  • 期刊名称：Microelectronics Reliability
  • 时间：0
  • 页码：2856-2860
  • 相关项目：铜互连体系ZrxSiy超薄扩散阻挡层的性能与机理研究
作者： Wang Ying, Ji Feng-li, Gao Song-song|
同期刊论文项目
铜互连体系ZrxSiy超薄扩散阻挡层的性能与机理研究
期刊论文 16 专利 1
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