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Diffusion barrier capability of Zr-Si films for copper metallization with different substrate bias v
  • 期刊名称：Thin Solid Films
  • 时间：0
  • 页码：5593-5596
  • 相关项目：铜互连体系ZrxSiy超薄扩散阻挡层的性能与机理研究
作者： Ying Wang, Fei Cao, Lei Shao, Ming-Hui Ding|
同期刊论文项目
铜互连体系ZrxSiy超薄扩散阻挡层的性能与机理研究
期刊论文 16 专利 1
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