中文摘要：

采用电弧离子镀技术，以W18Cr4V高速钢为基体，调整基体负偏压，制得多个复合TiAIN薄膜试样．研究了基体负偏压对薄膜微观组织形貌、物相组成、晶格位向、硬度、厚度和沉积速率的影响。结果表明，过高或过低的负偏压会使得膜层表面不平整，显微硬度下降。当负偏压为200V时，膜层的沉积速率最大；负偏压为150V时，有利于薄膜（111）晶面的择优取向生长，且TiAIN膜的硬度最高。

英文摘要：

TiA1N thin films were fabricated via arc ion plating on the W18Cr4V high-speed steel under different nega- tive biases. The influence of negative bias on the microstructure, phase, and crystalline orientation, hardness, and deposition rate of the films were investigated. The results show that the films have a coarse surface at too high or too low biases, resulting in lower hardness. The largest deposition rate is achieved at -200 V bias. The TiA1N thin film has a （ 111 ） preferred orienta- tion when deposited at -150 V bias, where the largest hardness is achieved