为优化ZnO:Ti复合薄膜制备工艺,采用射频磁控溅射法在不同氧氩比条件下沉积ZnO:Ti复合薄膜,得到的样品经由EDS能谱仪检测Ti掺杂质量分数为3%.分别利用台阶仪、扫描电子显微镜、X线衍射仪、分光光度计和霍尔效应仪对样品的沉积速率、微观结构和光电性能进行表征.结果表明:随着氧氩比逐渐增大,薄膜的沉积速率呈现先增加后减小的变化.所有ZnO:Ti薄膜均为六角纤锌矿结构,具有(002)晶面择优取向;当氧氩比为1:1时,薄膜样品的表面形貌和结构优于其他样品.经过在空气中500℃的退火处理,薄膜样品的结晶质量明显提高.所有ZnO:Ti薄膜在可见光区透过率均大于90%.随着氧氩比的增加,薄膜样品的电阻率先减小后增加,当氧氩比为1:1时,电阻率最小,为6.5×10^-4Ω·cm,薄膜的综合性能达到最优.
In order to optimize the fabrication process, ZnO : Ti composite films were deposited by r.f. magnetron sputtering at different oxygen/argon ratios, which had 3% Ti-doping according to the results of EDS analysis. The deposition rate, micro- structure and photoelectric properties were investigated by profiler, scanning electronic microscopy (SEM), X-ray diffraction (XRD), spectrophotometer and a Hall effect tester respectively. The results show that the deposition rate of the films first in- creases and then decreases with increasing oxygen/argon ratio. All ZnO : Ti films have a hexagonal wurtzite structure with the (002) plane preferred; the as-deposited films with optimized morphology and microstructure are obtained at oxygen/argon ra- tio of 1 : 1. Crystalline structure of the films can be greatly improved by annealing at 500 ℃ in the atmosphere. The transmit- tance of all ZnO : Ti films is higher than 90%. The electrical resistance first decreases and then increases with increasing oxy- gen/argon ratio. The minimum resistance is 6.5×10^-4Ω·cm for the rims that have optimized comprehensive properties when oxygen/ar-gon ratio is 1 : 1.