中文摘要：

本工作将阴极真空电弧沉积法和磁控溅射离子镀法结合形成复合镀膜工艺，即用电弧蒸发Ti靶的同时，用磁控溅射Al靶，并通入反应气体N2，以在高速钢基底上镀制AlTiN薄膜，考察了复合镀膜方法获得的AlTiN薄膜的表面形貌，并将其与单一法镀膜的表面形貌进行了对比分析。电弧离子镀制备的AlTiN薄膜表面颗粒很多，而且尺寸大，表面很粗糙，磁控溅射制备的AlTiN薄膜表面光滑平整，复合镀得到的AlTiN薄膜表面粗糙度介于二者之间，但从形貌上看，复合镀的薄膜呈现出典型的层状生长特征，在SEM下可清晰地看到表面的层状生长在部分区域不完全。测试发现，复合镀薄膜形貌并不是电弧镀和溅射镀薄膜形貌的简单混合，而是具有自身独特的特征，这可能是由于电弧弧光等离子体与溅射的辉光等离子体相互作用的结果。

英文摘要：

This work combines the two methods which are arc ion plating （AIP） and magnetron sputtering ion plating （MSIP） to form a composite ion plating （CIP）. That is, the Ti target is evaporated by arc while Al target is magnetron sputtered simultaneously in the nitrogen plasma in order to deposit AlTiN films on high-speed steels. The surface morphology of the films obtained by the composite method was compared with those fabricated by individual method. It is seen that there are many macro-particles on the films deposited by AIP, resulting in a rough surface, while the A1TiN films fabricated by MSIP have smooth surfaces. The roughness of the films fabricated by CIP is intervenient. What is interesting is that the surface morphology by CIP exhibits classic layer-by-layer characteristics, as shown by the SEM observations. The CIP morphology is not a simple mixture of morphologies of AIP and MSIP, but has its special characteristics. This phenomenon might be ascribed to the interaction of arc plasma of AIP and glow-discharge plasma of MSIP.