中文摘要：

研究了时效温度、时效时间以及冷变形对CuNiSiP合金时效性能的影响,并利用Gleeble-1500D热模拟试验机,采用高温等温压缩试验,研究了变形温度和变形速率对CuNiSiP合金高温压缩变形行为的影响。结果表明：CuNiSiP合金经冷变形后时效能得到较高的综合性能,其经60%变形450℃时效2h,显微硬度达到242HV0.05,导电率达到35.61%IACS;应变速率和变形温度的变化对合金的再结晶影响较大,变形温度越高,应变速率越小,合金越容易发生动态再结晶,其所对应的峰值应力相对越低。

英文摘要：

Effects of cold deformation, aging temperature and aging time on properties of CuNiSiP alloy were studied. The flow behavior of CuNiSiP alloy during hot compression deformation was studied by isothermal compression test at Gleehle-1500D thermal-mechanical simulator. The results show that properties of the CuNiSiP alloy can be improved after cold deformation then aging, the microhardness and the electrical conductivity of the CuNiSiP alloy aged at 450℃ for 2 h ＇after cold deformation are 242 HV0. 05 and 35.61% IACS, respectively. The dynamic recrystallization of the alloy is controlled by strain rate and deforming temperature. The higher the deformation temperature, the less the strain rate,the more prone the dynamic recrystallization takes place, and the lower the peak stress is.