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中文摘要：
研究了时效温度、时间和冷变形后时效对Cu-Ni-Si-Cr-P合金微观组织和性能的影响。结果表明,合金经900℃固溶处理后,在500℃×2h时效时合金电导率和硬度（HV）分别达到21.87 MS/m和234.5。变形量为60%的Cu-Ni-SiCr-P合金经450℃×1h时效可获得良好的综合性能,其电导率达到20.07MS/m,硬度（HV）达到255.3。对Cu-Ni-Si-CrP合金450℃时效试样进行显微分析,发现了细小弥散的Ni2Si和Ni3P析出物。
英文摘要：
Effects of aging temperature,aging time and different cold deformation rate on microstructure and properties of Cu-Ni-Si-Cr-P alloy were investigated.The results show that after aged at 500℃for 2h,electrical conductivity and hardness of Cu-Ni-Si-Cr-P alloy with solution treated at 900℃reach 21.87MS/m and 234.5HV,respectively.The favorable comprehensive properties can be obtained with electrical conductivity of 20.07 MS/m and microhardness of 255.3HV,respectively,after 60%cold deformation by aging at 450 ℃ for 1h.When aged at 450 ℃,the precipitated phases which are identified as Ni2 Si and Ni3 P based on the selected-area electron diffraction pattern,are dispersedly distributed in the matrix.
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