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中文摘要：
利用Gleeble-1500D热模拟试验机，研究了Cu—Ni—Si-Cr合金在不同应变速率和不同变形温度下流变应力与应变速率、变形温度之间的关系及其组织在热压缩过程中的变化．结果表明，应变速率和变形温度的变化对合金的再结晶影响较大，变形温度越高，合金越容易发生动态再结晶，应变速率越小，合金也越容易发生动态再结晶；在同一应变速率下合金动态再结晶的显微组织受到变形温度的强烈影响；并利用Arrhenius双曲正弦函数求得Cu—Ni—Si—Cr热变形激活能Q为265．9kJ／mol．
英文摘要：
The flow stress behavior of Cu-Ni-Si-Cr alloy was investigated in the temperature rang from 600 ℃ to 800 ℃ and in the strain rate range from 0.01 s^-1 to 5 s^-1 on Gleeble-1500D test machine. The relationships between the flow stress strain rate and deformation temperature were studied. The microstructure of the experimental alloy was inspected in the hot-compression proce- dure. The results show that the dynamic recrystallization is controlled by both strain rate and deformation temperature. The higher the temperature or the less the strain rate, the more easily will take place the dynamic recrystallization. The microstructure depends on the deformation temperature. The hot deformation activation energy of Cu-Ni-Si-Cr alloy during hot deformation is 265.9 kJ/mol.
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