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中文摘要：
本文根据RTWUSM驱动电路的特点,拟用MCM技术对部分电路进行集成设计,应用Ansys对该驱动集成单元在不同对流情况下进行热仿真,模拟得到集成单元中的温度分布及散热状况,分析结果表明在空气强制对流情况下比空气自然对流时电机驱动控制装置内的芯片最高结温要低,散热状况较好,从而为电机驱动控制电路的集成设计提供理论依据。
英文摘要：
Based on the drive features of RTWUSM, parts of the driving circuit will be integrated by MCM. Ansys has been used for thermal simulation of the integrated circuit units in the different convection situa- tion. The temperature distribution and radiating of the units have been calculated. The results show that the highest junction temperature of the chips in the device under forced air convection is lower than that under natural air convection, and the heat elimination of the chips is better. The results provide the theoretical ba- sis for the integrate design of the drive and control circuits of RTWUSM.
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