在两体近似碰撞模型基础上,采用SRIM程序对自注入硅离子及其造成的损伤在样品的分布进行了研究,模拟了Si+自注入Si晶体的Si+深度分布几率和注入时的能量传递。计算结果表明:在相同注入能量的情况下,注入Si+的分布概率是恒定的,在注入过程中电离能是阻止Si+进一步深入的主导因素。论文还初步讨论了注入剂量和退火温度对发光强度的影响,以及W缺陷的可能形成原因。
Based on the binary collision approximation(BCA),the defect distribution in the self-ion implantation and its energy transfer in Si crystal had been investigated by using the SRIM program.The calculated results indicated that the distribution probability of implanted Si+ is constant in the crystal Si,if the implantation energies are the same.The dominating factor which stops the implanted Si+ further deepening is demonstrated to be the value of the ionization energy.In this paper,the effects of implanted does and annealing temperature on the photoluminescence intensity and the origin of W defect were well discussed.