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Study of Low temperature bonding process using mixed Cu-Ag nanopaste for electronic packaging
  • 所属机构名称：清华大学
  • 会议名称：Materials Science &Technology 2011 Conference & Exhibition
  • 时间：2011.10.10
  • 成果类型：会议
  • 相关项目：纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
作者： Guisheng ZOU|Jianfeng YAN|Xiaoyu WANG|Fengwen MU|Hailin BAI|Aiping WU|Anming HU|Y.Norman ZHOU|
同会议论文项目
纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
期刊论文 19 会议论文 27
同项目会议论文
Low temperature sintering-bonding using mixed Cu+Ag nanoparticle paste for packaging application
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纳米银与纳米铜混合焊膏用于电子封装低温烧结连接
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