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Characterization of low temperature bonding with Cu nanopaste for electronic packaging applicatio
  • 所属机构名称：清华大学
  • 会议名称：Materials Science & Technology 2011 Conference & Exhibition
  • 时间：2011.10.10
  • 成果类型：会议
  • 相关项目：纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
作者： Jianfeng YAN|Guisheng ZOU|Xiaoyu Wang|Fengwen MU|Hailin BAI|Aiping WU|Anming HU|Y.Norman ZHOU|
同会议论文项目
纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
期刊论文 19 会议论文 27
同项目会议论文
Low temperature sintering-bonding using mixed Cu+Ag nanoparticle paste for packaging application
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Heat Generation in Ag Nanowires Induced by Femtosecond Laser Irradiation
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高温服役对纳米银焊膏封装接头力学性能的影响
Large-Scale Synthesis of Ag Nanoparticles by Polyol Process for Low Temperature Bonding Application
微连接和纳连接研究新进展
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A study on low temperature sintering-bonding of Cu metal bulks with Ag-nanoparticle powders for high
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纳米银与纳米铜混合焊膏用于电子封装低温烧结连接
含镀银铜粉的微米氧化银混合焊膏用于封装连接研究.
新兴的纳连接研究及其现状
Femtosecond laser welding for micro-device integration
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