位置：成果数据库 > 会议 > 会议详情页
Femtosecond laser welding for micro-device integration
  • 所属机构名称：清华大学
  • 会议名称：First International Conference on Nanojoining and Microjoining ( NMJ 2012)
  • 时间：2012.12.12
  • 成果类型：会议
  • 相关项目：纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
作者： L. Liu|L. Quintino|G. Zou|A.Hu|Y.Zhou|
同会议论文项目
纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
期刊论文 19 会议论文 27
同项目会议论文
Low temperature sintering-bonding using mixed Cu+Ag nanoparticle paste for packaging application
Sintering mechanisims and mechanical properites of Ag-coated copper bulk joints fabricated with silv
From Microjoining to Nanojoining
纳米金属颗粒膏合成及其低温烧结连接的电子封装应用研究进展
A Study on The Low Temperature Sintering-Bonding through In-Situ Formation of Ag Nanoparticles Using
Heat Generation in Ag Nanowires Induced by Femtosecond Laser Irradiation
High temperature service property evaluation of Ag-Nanoparticle sintered Cu-Cu joints
Low temperature sintering- bonding with Cu NPs for electronic packaging application
Metal–metal bonding process using copper nanoparticle paste prepared by ployol method
Metal–metal bonding process using Cu-Ag mixed nanoparticle paste
Low temperature bonding through the sintering of Ag nanoparticles in-situ formed using micro-Ag2O co
Metal-metal Bonding Process using Metal Nanoparticle Paste Prepared by Polyol Method in Quantity
Bonding of Cu Bulks through the Low Temperature Sintering of Ag Nanoparticles in-situ Formed using M
The effects of Ag-coated Cu particles added into micro-Ag2O paste on the sintered joint performance
A Study of Sintering Bonding Using Silver Nanowires Paste
高温服役对纳米银焊膏封装接头力学性能的影响
Large-Scale Synthesis of Ag Nanoparticles by Polyol Process for Low Temperature Bonding Application
微连接和纳连接研究新进展
Ag-Cu合金纳米焊膏的合成及其低温烧结连接研究
A study on low temperature sintering-bonding of Cu metal bulks with Ag-nanoparticle powders for high
Characterization of low temperature bonding with Cu nanopaste for electronic packaging applicatio
Study of Low temperature bonding process using mixed Cu-Ag nanopaste for electronic packaging
纳米银与纳米铜混合焊膏用于电子封装低温烧结连接
含镀银铜粉的微米氧化银混合焊膏用于封装连接研究.
新兴的纳连接研究及其现状
Synthesis of nanoscale metal powder paste and application in electronic packaging