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Bonding of Cu Bulks through the Low Temperature Sintering of Ag Nanoparticles in-situ Formed using M
  • 所属机构名称：清华大学
  • 会议名称：The First International Conference on Nanojoining and Microjoining ( NMJ 2012)
  • 时间：2012.12.12
  • 成果类型：会议
  • 相关项目：纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
作者： Fengwen Mu|Guisheng Zou|Zhenyu Zhao|Jianfeng Yan|Hailin Bai|Aiping Wu|Jiuchun Yan|Lei Liu|Y.Norman Zhou|
同会议论文项目
纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
期刊论文 19 会议论文 27
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