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Ag-Cu合金纳米焊膏的合成及其低温烧结连接研究
  • 所属机构名称：清华大学
  • 会议名称：第20届全国钎焊及特种连接技术交流会
  • 时间：2013.9.9
  • 成果类型：会议
  • 相关项目：纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
作者： 张冬月|余陈|邹贵生|刘磊|白海林|吴爱萍|周运鸿|
同会议论文项目
纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
期刊论文 19 会议论文 27
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含镀银铜粉的微米氧化银混合焊膏用于封装连接研究.
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