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中文摘要：
以（NH4）2SO4（0．01mol／L）＋NaHSO3（0．01mol／L）＋NaCI（0．01mol/L）为腐蚀介质，采用干湿交替复合循环试验，利用XPS、SEM表面分析技术，研究了HSO^-3、Cl^-和NH^＋4对铜的腐蚀影响，探讨了铜在该试验条件下的腐蚀机制。结果表明，铜在该条件下的质量损失随试验时间呈线性增加，其腐蚀率基本恒定，腐蚀产物不具有保护性；腐蚀产物主要为Cu2O、CuO及碱式硫酸铜。XPS分析技术用于腐蚀表面的化学成分测定是很有效的。
英文摘要：
An accelerated test of immersion-dry-Wet combined cycles with the medium of （NH4）2SO4 （0.01mol/L） ＋ NariS03 （0.01mol/L） ＋ NaCl（0.01mol/L） was used to simulate the field corrosion process. The patina formed in the accelerated test was analyzed by SEM and XPS in order to discuss the effects of HSO^-3, Cl^- , and NH^＋4 on the corrosion of copper exposed to the simulated medium. In addition, the corrosion mechanism of copper was studied. The results showed that the corrosion process of copper could be described by a formula of △XW=A ＋B ＊ T; The main corrosion products are Cu2O, CuO, and basic copper sulphates.
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