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Thermal contact resistance between the surfaces of silicon and copper crucible during electron beam
  • ISSN号：1290-0729
  • 期刊名称：International Journal of Thermal Sciences
  • 时间：2013.12.12
  • 页码：37-43
  • 相关项目：电子束注入对多晶硅Si/SiO2界面处杂质硼迁移的影响研究
作者： Wen, Shutao|Tan, Yi|Shi, Shuang|Dong, Wei|Jiang, Dachuan|Liao, Jiao|Zhu, Zhi|
同期刊论文项目
电子束注入对多晶硅Si/SiO2界面处杂质硼迁移的影响研究
期刊论文 21 专利 5
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