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Research on topography control of two-spindle and three-workstation wafer grinder
  • 期刊名称：Proceedings of the Institution of Mechanical Engin
  • 时间：0
  • 页码：2232-2241
  • 语言：英文
  • 相关项目：硅片与光电晶体基片的高效低损伤超精密磨削技术研究
作者： X.L. Zhu|R K Kang|H M Lv|G Feng|
同期刊论文项目
硅片与光电晶体基片的高效低损伤超精密磨削技术研究
期刊论文 74 著作 1
同项目期刊论文
A Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-precision Grinding of Silicon Wafers
Development of Three-Dimensional Dynamometer for Wafer grinder
Study on the Subsurface Damage Distribution of the Silicon Wafer Ground by Diamond Wheel
Experimental Study on Micro-Nano Scratching of Mono-Crystalline Silicon Wafer
单晶硅片超精密磨削技术与设备
大尺寸硅片自旋转磨削运动分析与仿真
树脂游离磨料线切割硅晶体中的磨料力学行为研究综述
Design and Simulation of Grinding Force Control System for Wafer Self-rotating Grinding
The research on the improved CMG tool for Al2O3 ceramic
Research on the Polishing Performance of CMP Slurry for the Sapphire Crystal
硅片加工表面层损伤检测技术的试验研究
树脂结合剂含量对单晶硅片减薄加工用砂轮性能的影响规律研究
Surface and Subsurface Damages of CdZnTe Substrates Ground by Diamond Grinding Wheel
Surface shape control of the workpiece in a double-spindle triple-workstation wafer grinder
Research on the Chemical-Mechanical Grinding (CMG) Tools for Al2O3 Ceramic
Raman Analysis of the Silicon Wafer Scratched by Single Point Diamond
单晶硅片磨削损伤的透射电子显微分析
单晶硅片磨削的表面相变
硅片自旋转磨削损伤深度的试验研究
大尺寸Si片自旋转磨削表面的损伤分布研究
应用软磨料磨削的单晶硅超精密制造技术
树脂结合剂金刚石砂轮精密磨削单晶硅片的磨削力研究
硅片自旋转磨削表面粗糙度建模与分析