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Research on the Polishing Performance of CMP Slurry for the Sapphire Crystal
  • 期刊名称：Advanced Materials Research
  • 时间：0
  • 页码：457-463
  • 语言：英文
  • 相关项目：硅片与光电晶体基片的高效低损伤超精密磨削技术研究
作者： Z.G. Dong|S. Gao|Z.J. Jin|R.K. Kang|
同期刊论文项目
硅片与光电晶体基片的高效低损伤超精密磨削技术研究
期刊论文 74 著作 1
同项目期刊论文
A Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-precision Grinding of Silicon Wafers
Development of Three-Dimensional Dynamometer for Wafer grinder
Study on the Subsurface Damage Distribution of the Silicon Wafer Ground by Diamond Wheel
Experimental Study on Micro-Nano Scratching of Mono-Crystalline Silicon Wafer
单晶硅片超精密磨削技术与设备
大尺寸硅片自旋转磨削运动分析与仿真
树脂游离磨料线切割硅晶体中的磨料力学行为研究综述
Design and Simulation of Grinding Force Control System for Wafer Self-rotating Grinding
The research on the improved CMG tool for Al2O3 ceramic
硅片加工表面层损伤检测技术的试验研究
Research on topography control of two-spindle and three-workstation wafer grinder
树脂结合剂含量对单晶硅片减薄加工用砂轮性能的影响规律研究
Surface and Subsurface Damages of CdZnTe Substrates Ground by Diamond Grinding Wheel
Surface shape control of the workpiece in a double-spindle triple-workstation wafer grinder
Research on the Chemical-Mechanical Grinding (CMG) Tools for Al2O3 Ceramic
Raman Analysis of the Silicon Wafer Scratched by Single Point Diamond
单晶硅片磨削损伤的透射电子显微分析
单晶硅片磨削的表面相变
硅片自旋转磨削损伤深度的试验研究
大尺寸Si片自旋转磨削表面的损伤分布研究
应用软磨料磨削的单晶硅超精密制造技术
树脂结合剂金刚石砂轮精密磨削单晶硅片的磨削力研究
硅片自旋转磨削表面粗糙度建模与分析