中文摘要：

结合单晶硅片的发展,回顾了单晶硅片超精密磨削技术与设备的发展历程,对比分析了广泛应用的转台式磨削、硅片旋转磨削和双面磨削等硅片磨削技术的原理及代表性设备的特点,讨论了用于单晶硅片平整化加工和背面减薄加工的低损伤磨削技术的最新进展,并对单晶硅片磨削技术的发展趋势进行了展望。

英文摘要：

The advances of surface grinding technology and grinder of silicon wafers were introduced based on the development of silicon wafers.The grinding principles and the characteristics of representative grinders widely using for silicon wafer grinding technologies,i.e.,rotary table grinding,wafer rotation grinding,and double-side grinding,were comparatively analyzed.The latest advances of low-damage grinding technologies for silicon wafers back thinning and planarization were discussed and the trend of the wafer grinding technology was prospected.