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中文摘要：
采用离子镀技术于45#钢基体表面在低温（164～115 K）和常温（291 K）条件下沉积Cu膜,通过X射线衍射仪、扫描电子显微镜研究Cu膜的晶体结构及其表面形貌,采用划痕试验法测量Cu膜的临界载荷（Lc）,在真空球-盘摩擦磨损试验机上考察其摩擦磨损性能并探讨其磨损机理.结果表明：基体温度对Cu膜的择优取向影响明显,在常温（291 K）下沉积的Cu膜为（200）择优取向,基体温度降至164 K以下所沉积的Cu膜呈现出明显的（111）择优取向;低温沉积Cu膜的表面较为光滑,其Lc值明显高于常温沉积的Cu膜;低温沉积Cu膜的磨损率明显低于常温沉积Cu膜,表现出良好的耐磨性,这主要是由于低温沉积Cu膜具有（111）择优取向和良好的膜-基结合力的缘故.
英文摘要：
Cu films were deposited on carbon steel substrates at low temperatures （LT, 164 K-115 K） and room temperature （RT） by ion plating. The crystal structure and morphology of the Cu films were analyzed by X-ray diffraction and scanning electron microscopy. The friction and wear properties were tested by home-made ball-on-disk vacuum tribometer. The adhesive critical load （Lc ） between Cu film and substrate was also measured by scratch tester. The results show that substrate temperature significantly affected the preferred orientation of ion-plated Cu films. At-600 bias voltages, the LT Cu films showed （111 ） preferred orientation, while the RT Cu films showed （200） preferred orientation. In compared with the RT Cu films, the LT Cu films exhibited smoother surface morphology and better adhesion between the film and substrate. Wear rates of the LT Cu films were significantly lower than that of the RT Cu films in vacuum. The friction and wear properties were discussed in terms of structure and mechanical properties of the Cu films.
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