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中文摘要：
采用非平衡磁控溅射技术在不锈钢以及单晶硅基体上制备了CrNx薄膜,并利用X射线衍射仪（XRD）、场发射扫描电镜（FESEM）、能量色散X射线能谱仪（EDS）和纳米压痕仪对薄膜的结构和性能进行了表征。结果表明,随着溅射电流的增大,薄膜中N/Cr比值减小,相组成由CrN（200）向Cr2N（111）转变;晶粒尺寸减小,柱状结构消失,结构变得致密;由于在大溅射电流下,易于形成Cr2N高硬度相,而且形成的薄膜晶粒细小、结构致密,所以硬度值随溅射电流单调升高,在21A时达到最高,为21GPa。
英文摘要：
CrNx films were deposited on stainless steel and Si wafer substrates via unbalanced magnetron sputtering technique.The microstructure and mechanical properties of the as-deposited films were investigated by means of field emission scanning electron microscope（FESEM）,X-ray diffraction（XRD）,energy dispersive X-ray analysis（EDS）and nanoindentation.With the sputtering current increasing,the N/Cr ratio decreased,the phase changed from CrN（200）to Cr2N（111）,the grain size became smaller,and the microstructure became denser as accompanied with the transformation from a columnar morphology to a featureless morphology.The hardness increased monotonously with the increase of sputtering current due to the formation of hard Cr2N phase and dense structure at high sputtering currents.As a result,the film deposited at 21A exhibited the highest hardness of 21GPa.
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