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Fabrication of 80-nm T-gate high indium In0.7Ga0.3As/In0.6Ga0.4As composite channels mHEMT on GaAs substrate with simple technological process
  • ISSN号:1674-4926
  • 期刊名称:《半导体学报:英文版》
  • 时间:0
  • 分类:TN304.7[电子电信—物理电子学] TN325.3[电子电信—物理电子学]
  • 作者机构:[1]Guangxi Key Laboratory of Precision Navigation Technology and Application, Guilin University of Electronic Technology,Guilin 541004, China, [2]Key Laboratory of Nanodevices and Applications, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy ofSciences, Suzhou 215123, China, [3]Nano Fabrication Facility, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou 215123,China
  • 相关基金:Project supported by the Key Laboratory of Nano-Devices and Applications, Nano-Fabrication Facility of S1NANO, Chinese Academy of Sciences, the National Natural Science Foundation of China (Nos. 61274077, 61474031, 61464003), the Guangxi Natural Sci- ence Fotmdation (Nos. 2013GXNSFGA019003, 2013GXNSFAA019335), the National Basic Research Program of China (Nos. 2011CBA00605, 2010CB327501), the Project (No. 9140C140101140C14069), and the Innovation Project of GUET Graduate Education (Nos. GDYCSZ201448, GDYCSZ201449, YJCXS201529).
中文摘要:

An 80-nm gate length metamorphic high electron mobility transistor(mHEMT) on a GaAs substrate with high indium composite compound-channels In0.7Ga0.3As/In0.6Ga0.4As and an optimized grade buffer scheme is presented.High 2-DEG Hall mobility values of 10200 cm2/(V·s) and a sheet density of 3.5 × 1012 cm-2 at 300 K have been achieved.The device’s T-shaped gate was made by utilizing a simple three layers electron beam resist,instead of employing a passivation layer for the T-share gate,which is beneficial to decreasing parasitic capacitance and parasitic resistance of the gate and simplifying the device manufacturing process.The ohmic contact resistance Rc is 0.2 Ω·mm when using the same metal system with the gate(Pt/Ti/Pt/Au),which reduces the manufacturing cycle of the device.The mHEMT device demonstrates excellent DC and RF characteristics.The peak extrinsic transconductance of 1.1 S/mm and the maximum drain current density of 0.86 A/mm are obtained.The unity current gain cut-off frequency(fT) and the maximum oscillation frequency(/max) are 246 and 301 GHz,respectively.

英文摘要:

An 80-nm gate length metamorphic high electron mobility transistor (mHEMT) on a GaAs substrate with high indium composite compound-channels Ino.7Ga0.aAs/Ino.6Gao.aAs and an optimized grade buffer scheme is presented. High 2-DEG Hall mobility values of 10200 cm2/(V.s) and a sheet density of 3.5 x 10^12 cm-2 at 300 K have been achieved. The device's T-shaped gate was made by utilizing a simple three layers electron beam resist, instead of employing a passivation layer for the T-share gate, which is beneficial to decreasing parasitic capacitance and parasitic resistance of the gate and simplifying the device manufacturing process. The ohmic contact resistance Rc is 0.2 n.mm when using the same metal system with the gate (Pt/Ti/Pt/Au), which reduces the manufacturing cycle of the device. The mHEMT device demonstrates excellent DC and RF characteristics. The peak extrinsic transconductance of 1.1 S/mm and the maximum drain current density of 0.86 A/mm are obtained. The unity current gain cut-off frequency (fT) and the maximum oscillation frequency (fmax) are 246 and 301 GHz, respectively.

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期刊信息
  • 《半导体学报:英文版》
  • 中国科技核心期刊
  • 主管单位:中国科学院
  • 主办单位:中国电子学会 中国科学院半导体研究所
  • 主编:李树深
  • 地址:北京912信箱
  • 邮编:100083
  • 邮箱:cjs@semi.ac.cn
  • 电话:010-82304277
  • 国际标准刊号:ISSN:1674-4926
  • 国内统一刊号:ISSN:11-5781/TN
  • 邮发代号:2-184
  • 获奖情况:
  • 90年获中科院优秀期刊二等奖,92年获国家科委、中共中央宣传部和国家新闻出版署...,97年国家科委、中共中央中宣传部和国家新出版署三等奖,中国期刊方阵“双效”期刊
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  • 被引量:7754