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Formation and characterization of Ni/Al Ohmic contact on n(+)-type GeSn
  • ISSN号：0038-1101
  • 期刊名称：Solid-State Electronics
  • 时间：2015.12
  • 页码：178-181
  • 相关项目：硅基锗锡合金材料外延生长机理研究
作者： Zhang, Guangze|Li, Chuanbo|Cheng, Buwen|Wang, Qiming|
同期刊论文项目
硅基锗锡合金材料外延生长机理研究
期刊论文 35
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