针对表面硅微加工,运用层模型间几何元素运算获得粗掩膜的基本数据.采用工艺约束修演得到精掩膜,解决了多层刻蚀与可加工性问题,并进行模型重构,以校正设计模型的工艺不合理性.应用协同的方法解决了设计端模块与工艺端模块的集成问题,最终得到优化的设计模型和掩膜序列.
Based on surface micromachini the operation on geometric elements among ng process, the rough mask information is obtained by means of the layer models. The precise mask then is formed by revising the rough mask based on the process restrictions. Together with the reconstruction of the process model, the mask revision resolves the problem of multiple-layer etching and improves the manufacturability. The CAPP and CAD modules for micro devices are integrated coordinately to get an optimized design model and mask set.