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Analysis and Optimization of Thermal-Driven Global Interconnects in Nanometer Design
  • 期刊名称：IEEE Transactions on Components, Packaging and Man
  • 时间：0
  • 页码：1564-1572
  • 语言：英文
  • 相关项目：纳米工艺下可制造性和成品率驱动的集成电路设计方法学研究
作者： Lele Jiang|Yuhua Cheng|Junfa Mao|
同期刊论文项目
纳米工艺下可制造性和成品率驱动的集成电路设计方法学研究
期刊论文 14 会议论文 37 专利 10
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