综述三维热传导型半导体瞬态问题计算方法的新进展.数学模型是一类由四个方程组成的非线性耦合对流-扩散偏微分方程组的初边值问题.重点研究特征分数步差分方法,修正迎风分数步差分方法,特征交替方向变网格有限元方法,区域分裂及并行计算.
Numerical methods for transient behavior of semiconductor devices are studied. Mathematical model of a three-dimensional semiconductor device with heat conduction is described by a initial boundary value problem with four quasilinear partial differential equations. Finite difference fractional step method, characteristic finite element alternating direction method, domain decomposition method and theoretical analysis are focused on.