位置：成果数据库 > 会议 > 会议详情页
Effect of Electromigration on Intermetallic Compound Formation in Cu/Sn/Cu Interconnect
  • 所属机构名称：大连理工大学
  • 会议名称：2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电
  • 成果类型：会议
  • 会场：北京
  • 相关项目：无铅化电子封装钎焊界面反应及焊点可靠性的基础研究
作者： L. D. Chen|Mingliang Huang|
同会议论文项目
无铅化电子封装钎焊界面反应及焊点可靠性的基础研究
期刊论文 44 会议论文 31
同项目会议论文
Effect of [Au]/[Na2SO3] molar ratio on co-electroplating Au-Sn alloys in sulfite-based solution
Comparative study of interfacial reactions of high-Sn lead-free solders on single crystal Cu and on
Assessment of LF solder joint reliability by four point cyclic bending
The adsorption of Ag3Sn nano-particles on Cu-Sn intermetallic compounds of Sn-3Ag-0.5Cu/Cu during so
Effects of plating parameters on the Au-Sn co-electrodepositon for flip chip-LED bumps
Effect of electromigration on interfacial reaction of Cu/Sn3.0Ag0.5Cu/Ni solder joint at high temper
Study on the microstructure and the shear strength of Sn-0.7Cu-xZn
The influence of electromigration and aging on the reliability of SnAgCu lead-free solder joint at 1
Electromigration-induced failure of Ni/Sn3.0Ag0.5Cu/ENEPIG flip chip solder joint
Failure mechanisms of Ni/Sn3.0Ag0.5Cu/OSP flip chip solder under high current stressing
倒装芯片焊点中的热迁移
Sequential non-cyanide electroplating Au/Sn/Au films for flip chip-LED bumps
Effect of solder volume on interfacial reaction between Sn-3Ag-0.5Cu solder ball and Cu Pad after mu
Comparative study on interfacial reactions between Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder balls and ENEPIG
Effect of surface finish (OSP and ENEPIG) on failure mechanism induced by electromigration in Sn-3.0
Interfacial Reactions and Reliability Issues of Fine Pitch Flip-Chip Lead-free Solder Joints
Comparative study of interfacial reactions of high-Sn Pb-free solders on (001) Ni single crystal and
Effect of electromigration on the Cu-Ni cross-interaction in line-type Cu/Sn/Ni interconnect
Electroless nickel-boron plating on magnesium alloy
Effect of solder volume on interfacial reactions between Sn3.5Ag0.75Cu solder balls and Cu pad
Electromigration of 300 μm diameter Sn-3.0Ag-0.5Cu lead-free bumps in flip chip package
Effect of Electromigration on Intermetallic Compound Formation in Line-Type Cu/Sn/Cu and Cu/Sn/Ni In
Mechanical property and electrochemical corrosion behavior of Al/Sn-9Zn-XNi/Cu joints
Electromigration-induced interfacial reactions in line-type Cu/Sn/ENIG interconnect
Au-Sn co-electroplating solution for flip chip-LED bumps
Effect of Interfacial Reaction on Reliability of Flip Chip Lead-free Solder Joints
Corrosion of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in salt solutions
Effect of Ti on wettability and interface reaction of Sn0.7Cu lead-free solder
Investigation on microstructures and properties of low Ag content lead-free solder alloy
Mechanical properties and electrochemical corrosion behavior of Al-Cu solder joint with Sn-Zn based