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无铅化电子封装钎焊界面反应及焊点可靠性的基础研究
  • 项目名称：无铅化电子封装钎焊界面反应及焊点可靠性的基础研究
  • 项目类别：联合基金项目
  • 批准号：U0734006
  • 项目来源：国家自然科学基金
  • 研究期限：1900-01-01-1900-01-01
  • 项目负责人：黄明亮
  • 依托单位：大连理工大学
  • 批准年度：2007
成果综合统计
成果类型
数量
  • 期刊论文
  • 会议论文
  • 专利
  • 获奖
  • 著作
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期刊论文
Effect of Y(2)O(3) particles on microstructure formation and shear properties of Sn-58Bi solder
无氰金-锡合金电镀液的成分优化及电流密度确定
镀液pH值及浓度对铝基表面化学镀镍-磷镀层磷含量及镀速的影响
Sn-XAg-0.5Cu无铅钎料熔化特性、润湿性及力学性能研究
工艺参数对Sn0.3Ag0.7CuCu焊点界面组织和力学性能的影响
电迁移对Ni/Sn/Ni-P焊点界面反应的影响
分步法电镀制备金锡共晶凸点的组织
Effects of Aging on the Microstructural and Mechanical Properties of Sn-3.0Ag-0.5Cu Solder Joints of
Ti对Sn0.7Cu无铅钎料润湿性和界面的影响
低银SnAgCuBiNi无铅钎料润湿及溶解行为分析
Mechanical Properties and Electrochemical Corrosion Behavior of Al/Sn-9Zn-xAg/Cu Joints
电流密度对无氰电镀Au凸点生长行为的影响
化学镀Ni-P 与Sn-3.5Ag 在钎焊及时效过程中的界面反应
Sn-0.7Cu-xAg-yBi无铅钎料润湿性试验
Interfacial reactions between Sn-Cu based multicomponent solders and Ni substrates during soldering
不同应变速率下BGA焊球剪切断裂试验与模拟分析
电迁移对Ni／Sn3．0Ag0．5Cu／Au／Pd／Ni—P倒装焊点界面反应的影响
无铅BGA焊点温度循环失效机理
等温时效对SnAgCu焊点界面组织及剪切强度的影响
时效对BGA无铅焊点力学性能和断裂机制的影响
Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi//Cu lead-free solder joints
预处理对AZ31镁合金表面Ni-B化学镀层形貌及性能的影响
Bi对Sn-3Ag-0.5Cu/Cu无铅钎焊接头剪切强度的影响
强磁场对Sn-4Cu合金凝固过程中Cu_6Sn_5相的影响
Sn/Cu接头界面金属间化合物层的生长及强磁场的影响
Suppression of interfacial intermetallic compounds between Sn-9Zn solder and Cu-substrate by adding
Interfacial reaction between Au and Sn films electroplated for LED bumps
热时效对SnAgCu微焊点界面IMC和抗拉强度的影响
Electromigration-induced interfacial reactions in Cu/Sn/electroless Ni-P solder interconnects
钎焊及时效过程中化学镀Ni-P与Sn-3.5Ag的界面反应
Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu interconnect
低稳恒磁场对锡锌基合金液与铜片界面反应的影响
Wetting behavior and interfacial reactions in (Sn-9Zn)-2Cu/Ni joints during soldering and isothermal
LED倒装凸点Au/Sn双层薄膜界面反应的研究
SnAgCu无铅焊点界面组织及抗拉强度在时效过程中的演变
电迁移极性效应及其对Sn-3.0Ag-0.5Cu无铅焊点拉伸性能的影响
Current-induced interfacial reactions in Ni/Sn–3Ag–0.5Cu/Au/Pd(P)/Ni–P flip chip i
会议论文
Effect of [Au]/[Na2SO3] molar ratio on co-electroplating Au-Sn alloys in sulfite-based solution
Comparative study of interfacial reactions of high-Sn lead-free solders on single crystal Cu and on
Assessment of LF solder joint reliability by four point cyclic bending
The adsorption of Ag3Sn nano-particles on Cu-Sn intermetallic compounds of Sn-3Ag-0.5Cu/Cu during so
Effects of plating parameters on the Au-Sn co-electrodepositon for flip chip-LED bumps
Effect of electromigration on interfacial reaction of Cu/Sn3.0Ag0.5Cu/Ni solder joint at high temper
Study on the microstructure and the shear strength of Sn-0.7Cu-xZn
The influence of electromigration and aging on the reliability of SnAgCu lead-free solder joint at 1
Electromigration-induced failure of Ni/Sn3.0Ag0.5Cu/ENEPIG flip chip solder joint
Failure mechanisms of Ni/Sn3.0Ag0.5Cu/OSP flip chip solder under high current stressing
Effect of Electromigration on Intermetallic Compound Formation in Cu/Sn/Cu Interconnect
倒装芯片焊点中的热迁移
Sequential non-cyanide electroplating Au/Sn/Au films for flip chip-LED bumps
Effect of solder volume on interfacial reaction between Sn-3Ag-0.5Cu solder ball and Cu Pad after mu
Comparative study on interfacial reactions between Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder balls and ENEPIG
Effect of surface finish (OSP and ENEPIG) on failure mechanism induced by electromigration in Sn-3.0
Interfacial Reactions and Reliability Issues of Fine Pitch Flip-Chip Lead-free Solder Joints
Comparative study of interfacial reactions of high-Sn Pb-free solders on (001) Ni single crystal and
Effect of electromigration on the Cu-Ni cross-interaction in line-type Cu/Sn/Ni interconnect
Electroless nickel-boron plating on magnesium alloy
Effect of solder volume on interfacial reactions between Sn3.5Ag0.75Cu solder balls and Cu pad
Electromigration of 300 μm diameter Sn-3.0Ag-0.5Cu lead-free bumps in flip chip package
Effect of Electromigration on Intermetallic Compound Formation in Line-Type Cu/Sn/Cu and Cu/Sn/Ni In
Mechanical property and electrochemical corrosion behavior of Al/Sn-9Zn-XNi/Cu joints
Electromigration-induced interfacial reactions in line-type Cu/Sn/ENIG interconnect
Au-Sn co-electroplating solution for flip chip-LED bumps
Effect of Interfacial Reaction on Reliability of Flip Chip Lead-free Solder Joints
Corrosion of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in salt solutions
Effect of Ti on wettability and interface reaction of Sn0.7Cu lead-free solder
Investigation on microstructures and properties of low Ag content lead-free solder alloy
Mechanical properties and electrochemical corrosion behavior of Al-Cu solder joint with Sn-Zn based
黄明亮的项目
无铅化电子封装中固/液界面反应研究
期刊论文 1
基于3D封装的纳米孪晶Cu互连机理与可靠性
期刊论文 1
从基体金属溶解的角度研究现代电子封装中固/液界面反应
会议论文 2
微凸点中电迁移与Sn晶粒取向相互作用研究
期刊论文 5
可穿戴电子产品钎料-ACF柔性微互连Sn各向异性及电迁移行为研究
2013年第十四届电子封装技术国际学术会议
　SizeeffectmodelonkineticsofinterfacialreactionbetweenSn-xAg-yCusoldersandCusubstrate
单晶基体界面反应及其对微细无铅焊点可靠性的影响
期刊论文 61 会议论文 47 获奖 6 专利 1