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Effect of Electromigration on Intermetallic Compound Formation in Line-Type Cu/Sn/Cu and Cu/Sn/Ni In
  • 所属机构名称：大连理工大学
  • 会议名称：60th Electronic Components and Technology Conference
  • 成果类型：会议
  • 会场：Las Vegas, NV
  • 相关项目：无铅化电子封装钎焊界面反应及焊点可靠性的基础研究
作者： Zhou, S. M.|Chen, L. D.|Huang, M. L.|
同会议论文项目
无铅化电子封装钎焊界面反应及焊点可靠性的基础研究
期刊论文 44 会议论文 31
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