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Effect of Ti on wettability and interface reaction of Sn0.7Cu lead-free solder
  • 所属机构名称：大连理工大学
  • 会议名称：2011 International Symposium on Advanced Packaging Materials, APM 2011
  • 成果类型：会议
  • 会场：Xiamen, China
  • 相关项目：无铅化电子封装钎焊界面反应及焊点可靠性的基础研究
作者： Luo, Daojun|He, Guanghui|Wei, Guoqiang|Gao, Hongyong|
同会议论文项目
无铅化电子封装钎焊界面反应及焊点可靠性的基础研究
期刊论文 44 会议论文 31
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