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The adsorption of Ag3Sn nano-particles on Cu-Sn intermetallic compounds of Sn-3Ag-0.5Cu/Cu during so
  • 所属机构名称：大连理工大学
  • 成果类型：会议
  • 相关项目：无铅化电子封装钎焊界面反应及焊点可靠性的基础研究
作者： Zhao, Yanhui|Liu, Xiaoying|Huang, Mingliang|Wu, C. M. L.|Wang, Lai|
同会议论文项目
无铅化电子封装钎焊界面反应及焊点可靠性的基础研究
期刊论文 44 会议论文 31
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